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ATC 3750-6C-64
ATC 3750-6C-64
ATC 3750-6C-64
ATC 3750-6C-64
ATC 3750-6C-64
ATC 3750-6C-64

ATC 3750-6C-64

NVIDIA® Jetson AGX Orin™ ソリューション　オプションのファンキットでハイブリッド放熱を実現

高性能なNVIDIA® Jetson AGX™ Orin SOMを内蔵したATC 3750シリーズは、人工知能や機械学習アプリケーションにおいて、最大200/275 TOPSのワークロードを提供します。-30～65℃の広い温度範囲で動作し、耐振動・耐衝撃の軍事規格MILSTD-810Gに準拠しています。

  • NVIDIA® Jetson AGX Orin 最大 200/275 TOPS (INT8) 
  • LPDDR5 64G 実装済み
  • HDMI x 1, LAN （PoE+） x 6
  • USB3.2 x 2, OTG Micro-USB x 1
  • RS232 x 2, コンソール x 1
  • マルチポート （DI/DO） x 1, DI x 4, DO x 4
  • CAN （絶縁） x 1
  • eMMC 64GB 実装済み, M.2 NVMe x 1, SD x 1
  • Mini-PCIe スロット x 1, M.2 x 1 （LTE）
  • Nano-SIMスロット x 2 （国内 x 1）
  • GPS U-blox NEO-M9N モジュール x 1 
  • 9~36V DC 入力　CE, FCC, UKCA, E13
  •  210mm (W) x 173mm (D) x 75mm (H)　3.5 kg　-30℃～65℃

製品の概要

概要

AI has become an essential component of automated vehicle technologies. With its built-in high performance NVIDIA® Jetson AGX Orin™ SOM, the ATC 3750-6C can deliver up to 200/275 TOPS workload on Artificial Intelligence (AI) processing and inference, supporting applications such as ADAS in Transportation/Construction, ANPR, AMR, Machine Learning (ML), ITS and factory automation. 

 

Thanks to NEXCOM’s excellent thermal solutions, the ATC 3750-6C can work through its defined TDP (15W~60W) in harsh environments without a fan kit to achieve 200/275 TOPS workload performance. 

 

The ATC 3750-6C is a rugged, compact-size in-vehicle AI powered computer that features DC 9V~36V with IGN control, six PoE+ ports for accessing IP CAM/LiDAR sensors, and rich peripheral ports, USB 3.2, isolation CAN bus, RS-232, Console, DI/DO, OTGand HDMI®. With the installation of 5G NR, Wi-Fi 5/6 modules, the ATC 3750-6C can collaborate with CPS for AI model re-training, making it suitable for deployment in sophisticated applications such as ADAS/ANPR/AI-aided ITS/Construction, etc. In harsh environments, the ATC 3750-6C can operate at a wide temperature range of -25°C~70°C and meet the MIL-STD-810H military standard for anti-vibration and shock. For regulation, the ATC 3750-6C is certified by CE/FCC Class A, UKCA and E mark (E13).

仕様

  • CPU
    12-core Arm® Cortex®-A78AE v8.2 64-bit, 3MB L2 + 6MB L3
  • メモリ
    64GB 256-bit LPDDR5, 204.8GB/s
  • グラフィックス
    2048-core NVIDIA® Ampere architecture with 64 Tensor Cores
  • ストレージ
    64GB eMMC 5.1 flash storage, 200MHz (HS400 or HS533)
    1 x Accessible SD card (SDXC-I/UHS-I, SD 3.0)
    1 x M.2 Key M 2280 (PCIe 4.0 x4) NVMe SSD
  • 映像出力端子
    1 x HDMI® 2.0a/b, up to 3840x2160@60Hz
  • LAN
    6 x GbE port, RJ45 connector
  • COM
    2 x Full RS-232 (DB9)
  • USB
    2 x USB 3.2 Gen 2
  • GPIO
    4 x GPI, 4 x GPO
  • CAN バス
    2 x CAN 2.0A/2.0B
  • M.2 スロット
    1 x M.2 Key B 3042/3052 socket (USB 3.2/2.0)
    1 x M.2 Key E 3030 socket (PCIe 4.0, USB 2.0) for Wi-Fi 5/6
  • PCIe スロット
    1 x Full size Mini PCIe socket (PCIe 4.0, USB 2.0)
  • 電源入力
    Nominal voltage: DC 9V~36V
  • 寸法
    234.0mm (W) x 172.8mm (D) x 80.5mm (H) w/ mount bracket
  • 重量
    3.5kg
  • 対応 OS
    NEXCOM Aided Linux (NAL) w/ Jetpack 6.1 integrated
  • 動作環境
    Operating temperature: -25°C~70°C (TDP 15W~60W, fanless, w/ 80W PoE)
    Storage temperature: -40°C~85°C
    Relative humidity: 10%~95% (non-condensing)
  • 取得認証
    CE approval, FCC Class A, UKCA, E13 certified
  • GNSS
    u-blox NEO-M9N GNSS module for GPS/Gloness/QZSS/Galileo/Beidou
    Optional DR (Dead Reckoning) function, NEO-M9V/M8L
  • WWAN
    1 x M.2 Key B 3042/3052 socket (USB 3.2/2.0), 2 x nano-SIM slot

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